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Bump Paste - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Bump Paste Product List

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Senju Metal Industry Inner Bump Paste

Senju Metal Industry Inner Bump Paste

Semiconductor Paste BPS Series

M705-BPS is a lead-free solder paste developed for fine bump formation. It demonstrates good printability and stencil release at fine pitch, ensuring a stable amount of solder. Additionally, there are no occurrences of voids within the bumps.

  • Other metal materials
  • Bump Paste

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